Ladder Structure Triangular Micro Channels for Low Power and high Performance Micro Channel Cooling System

Abstract

Heat dissipation from micro devices is now becoming a critical field since the performance of the IC is mostly determined by temperature fields. The success of an IC cooling system or heat sink for ULSI depends on the ability to achieve effective heat transfer rate to the ?owing liquid and superior ?ow performance of the micro channels. Various studies on micro channel cooling systems (MCCS) in the past have focused on improving the flow characteristics of parallel rectangular micro channels. The present investigator aimed at improving the contact area in addition to achieving high convective heat transfer coefficient, thus introduced andreported ladder structure micro channel cooling systems (LSMCCS). The present study focuses on further improving the LSMCCS design so that high performance device cooling at low pumping power is achieved. First the various cross sectional shapes have been studied by keeping the cross sectional area and hydraulic diameter uniform to explore the possibility of further improving the performance of the micro cooling system. Hydraulic and thermal performance of ladder structure micro channels with rectangular, trapezium and triangular cross sectional shapes indicates that triangular shaped ladder structure micro channels would give the minimum pressure drop, the least thermal resistance at the least pumping power. Finally the investigator studied the performance of ladder structure triangular shaped micro channels cooling system with common inlet and outlet to simulate a packaged LSMCCS and the results show that ladder structure triangular shaped MCCS can give the best cooling performance. The temperature profiles that were obtained over the cross section of the inlet and outlet show that the LSMCCS can give excellent thermal resistance when triangular shape channels are employed and therefore can be ideal cooling systems for ULSI.